SAN JOSE, Calif., Sept. 15, 2014 /PRNewswire/ — FlexTech Alliance today issued a dual-focused Request for Proposals (RFP) for flexible, printed product demonstrators (demos) and a functional electronic print leaflet. FlexTech conducts a two-stage RFP process with pre-proposals due on October 22, 2014 and full proposals due in January 2015. Funds for proposals ultimately selected are provided by the US Army Research Laboratory (ARL) and have a significant cost share by the proposing organization.
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The primary goal of the open solicitation is to build several early stage demos which show the evolution of flexible electronics technology. A secondary goal is to highlight new concepts in materials, tools and prototype manufacturing. FlexTech is especially interested in receiving proposals that address a working demo in one or more of these market segments: power generation and energy storage, sensors, and communications.
The objective of the focused solicitation is to develop a functional electronic print leaflet incorporating a recordable audio message.
FlexTech Alliance anticipates making multiple awards for demos in the $250-$350K range, plus an equal cost share from the respondent. For the focused solicitation on functional electronic print, it will be up to the respondent to propose a budget.
"FlexTech is pleased to again partner with the Army on flexible electronics, as prior RFPs have resulted in several cutting edge technical developments successfully commercialized. With this RFP, we seek to mitigate some risk inherent in launching new demonstrators, while providing the means to engage the Army as an early adopter," stated Michael Ciesinski, president of FlexTech Alliance.
To download the full RFP, go to www.flextech.org and go to the "R&D Program" tab. Or, click here. Communication and questions during the proposal period and submission of proposals should be directed to this email: rfp2015@flextech.org.
About FlexTech Alliance
The FlexTech Alliance is an industry-led, public/private partnership developing and organizing the U.S. manufacturing expertise to expand the infrastructure required to support world-class manufacturing capability for flexible and printed electronics.
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